TY - GEN
T1 - High-frequency signal transmission characteristics of coplanar waveguides with cone bump interconnections
AU - Ikeda, A.
AU - Kajiwara, K.
AU - Watanabe, N.
AU - Asano, T.
PY - 2010
Y1 - 2010
N2 - We evaluated high frequency signal transmission characteristics of coplanar waveguides fabricated using cone bump interconnections on flip-chip bonded surfaces. The signal insertion loss (S21 parameter) increased with the number of bump interconnections. At 40 GHz, the signal insertion loss due to the bump interconnections was 0.017 dB / bump. This value was small enough for application to most radio-frequency devices. Besides, the bump interconnections did not alter the characteristic impedance of the waveguide from the designed even at 40 GHz. The results indicate that the cone bump offers high-frequency signal data transmission lines for chip-stack integration of LSIs.
AB - We evaluated high frequency signal transmission characteristics of coplanar waveguides fabricated using cone bump interconnections on flip-chip bonded surfaces. The signal insertion loss (S21 parameter) increased with the number of bump interconnections. At 40 GHz, the signal insertion loss due to the bump interconnections was 0.017 dB / bump. This value was small enough for application to most radio-frequency devices. Besides, the bump interconnections did not alter the characteristic impedance of the waveguide from the designed even at 40 GHz. The results indicate that the cone bump offers high-frequency signal data transmission lines for chip-stack integration of LSIs.
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U2 - 10.1109/TENCON.2010.5686711
DO - 10.1109/TENCON.2010.5686711
M3 - Conference contribution
AN - SCOPUS:79951613379
SN - 9781424468904
T3 - IEEE Region 10 Annual International Conference, Proceedings/TENCON
SP - 2191
EP - 2195
BT - TENCON 2010 - 2010 IEEE Region 10 Conference
T2 - 2010 IEEE Region 10 Conference, TENCON 2010
Y2 - 21 November 2010 through 24 November 2010
ER -