High frequency signal transmission characteristics of cone bump interconnections

A. Ikeda; N. Watanabe; T. Asano

doi:10.1109/3DIC.2012.6263011

High frequency signal transmission characteristics of cone bump interconnections

A. Ikeda, N. Watanabe, T. Asano

Integrated Electronic Systems

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

We evaluated high frequency signal transmission characteristics of coplanar waveguides fabricated using Au cone bump interconnections. Electroless Ni / Au bumps were used as counter-electrodes against the Au cone bumps. The signal transmission loss increased with the number of bump interconnections. At 40 GHz, the signal insertion loss due to the bump interconnections was 0.017 dB / bump with the 10 μm square size Ni / Au bumps. This value was small enough for application to radio-frequency devices. While, with the 5 μm square size Ni / Au bumps, open failure was observed between the bump interconnections. The open failure might be caused by decreasing of the contact pressure between the bumps, due to the mushroom-like shape of the Ni / Au bumps.

Original language	English
Title of host publication	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOIs	https://doi.org/10.1109/3DIC.2012.6263011
Publication status	Published - Dec 1 2011
Event	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, Japan Duration: Jan 31 2012 → Feb 2 2012

Publication series

Name	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Other

Other	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
Country/Territory	Japan
City	Osaka
Period	1/31/12 → 2/2/12

All Science Journal Classification (ASJC) codes

Control and Systems Engineering

Access to Document

10.1109/3DIC.2012.6263011

Cite this

Ikeda, A, Watanabe, N & Asano, T 2011, High frequency signal transmission characteristics of cone bump interconnections. in 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011., 6263011, 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011, 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011, Osaka, Japan, 1/31/12. https://doi.org/10.1109/3DIC.2012.6263011

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title = "High frequency signal transmission characteristics of cone bump interconnections",

abstract = "We evaluated high frequency signal transmission characteristics of coplanar waveguides fabricated using Au cone bump interconnections. Electroless Ni / Au bumps were used as counter-electrodes against the Au cone bumps. The signal transmission loss increased with the number of bump interconnections. At 40 GHz, the signal insertion loss due to the bump interconnections was 0.017 dB / bump with the 10 μm square size Ni / Au bumps. This value was small enough for application to radio-frequency devices. While, with the 5 μm square size Ni / Au bumps, open failure was observed between the bump interconnections. The open failure might be caused by decreasing of the contact pressure between the bumps, due to the mushroom-like shape of the Ni / Au bumps.",

author = "A. Ikeda and N. Watanabe and T. Asano",

year = "2011",

month = dec,

day = "1",

doi = "10.1109/3DIC.2012.6263011",

language = "English",

isbn = "9781467321891",

series = "2011 IEEE International 3D Systems Integration Conference, 3DIC 2011",

booktitle = "2011 IEEE International 3D Systems Integration Conference, 3DIC 2011",

note = "2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 ; Conference date: 31-01-2012 Through 02-02-2012",

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AU - Ikeda, A.

AU - Watanabe, N.

AU - Asano, T.

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N2 - We evaluated high frequency signal transmission characteristics of coplanar waveguides fabricated using Au cone bump interconnections. Electroless Ni / Au bumps were used as counter-electrodes against the Au cone bumps. The signal transmission loss increased with the number of bump interconnections. At 40 GHz, the signal insertion loss due to the bump interconnections was 0.017 dB / bump with the 10 μm square size Ni / Au bumps. This value was small enough for application to radio-frequency devices. While, with the 5 μm square size Ni / Au bumps, open failure was observed between the bump interconnections. The open failure might be caused by decreasing of the contact pressure between the bumps, due to the mushroom-like shape of the Ni / Au bumps.

AB - We evaluated high frequency signal transmission characteristics of coplanar waveguides fabricated using Au cone bump interconnections. Electroless Ni / Au bumps were used as counter-electrodes against the Au cone bumps. The signal transmission loss increased with the number of bump interconnections. At 40 GHz, the signal insertion loss due to the bump interconnections was 0.017 dB / bump with the 10 μm square size Ni / Au bumps. This value was small enough for application to radio-frequency devices. While, with the 5 μm square size Ni / Au bumps, open failure was observed between the bump interconnections. The open failure might be caused by decreasing of the contact pressure between the bumps, due to the mushroom-like shape of the Ni / Au bumps.

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T3 - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

BT - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

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Y2 - 31 January 2012 through 2 February 2012

ER -

High frequency signal transmission characteristics of cone bump interconnections

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