High-accuracy measurement on thermal displacement and strain distributions of electronic packaging

Yasuyuki Morita, Kazuo Arakawa, Mitsugu Todo

    Research output: Contribution to journalArticlepeer-review

    Abstract

    The thermal deformation of electronic package, QFP (Quad Flat Package), was measured by phase-shifting moiré interferometry. This method was developed using a wedge-glass-plate as a phase'shifter to obtain the displacement fields with the sensitivity of 80 nm/line. Digital image processing was also introduced to determine the strain distributions quantitatively. Thermal loading was applied by heating the package from room temperature 25°C to an elevated temperature 100°C. The result showed that the normal and shear strains concentrated in the packaging resins around the silicon chip, mount island, and lead frames.

    Original languageEnglish
    Pages (from-to)871-876
    Number of pages6
    JournalIEEJ Transactions on Electronics, Information and Systems
    Volume126
    Issue number7
    DOIs
    Publication statusPublished - 2006

    All Science Journal Classification (ASJC) codes

    • Electrical and Electronic Engineering

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