TY - GEN
T1 - Gene transfer by circulating plasma bubble flow
AU - Yamanishi, Yoko
AU - Tanaka, Ryotaro
AU - Arakawa, Yuta
AU - Nakatsu, Yoshimichi
N1 - Funding Information:
This work was supported by Ministry of Education, Culture, Sports, Science and Technology (25289059, 15H00903, 15K13917 and 16H04307) and JST PRESTO program.
Publisher Copyright:
© 2017 IEEE.
PY - 2017/2/23
Y1 - 2017/2/23
N2 - We have succeeded in injection of plasmid to adherent cells which are suspended in the plasma-bubbles laden circulation flow in a chamber. High-speed plasma-bubbles are generated by glass electrode and the air-liquid interface has a stiction force which draws the gene (plasmid) and stick to the air-liquid interface. The circulating flow increased the chance for cells to contact air-liquid interface of bubbles which enclosed plasma or reactive gas. Finally, the high reactive interface enables gene transfer to cells efficiently. This technology of two-dimensional microfluidic chip contributes an option to the high-throughput gene transfer.
AB - We have succeeded in injection of plasmid to adherent cells which are suspended in the plasma-bubbles laden circulation flow in a chamber. High-speed plasma-bubbles are generated by glass electrode and the air-liquid interface has a stiction force which draws the gene (plasmid) and stick to the air-liquid interface. The circulating flow increased the chance for cells to contact air-liquid interface of bubbles which enclosed plasma or reactive gas. Finally, the high reactive interface enables gene transfer to cells efficiently. This technology of two-dimensional microfluidic chip contributes an option to the high-throughput gene transfer.
UR - http://www.scopus.com/inward/record.url?scp=85015806537&partnerID=8YFLogxK
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U2 - 10.1109/MEMSYS.2017.7863438
DO - 10.1109/MEMSYS.2017.7863438
M3 - Conference contribution
AN - SCOPUS:85015806537
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 444
EP - 447
BT - 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
Y2 - 22 January 2017 through 26 January 2017
ER -