Abstract
GaN metal-oxide-semiconductor field-effect transistors (MOSFETs) on AlGaN/GaN heterostructure with a recess gate were fabricated and characterized. The device showed good pinch-off characteristics and a maximum field-effect mobility of 145.2 cm2·V−1·s−1. The effects of etching gas of Cl2 and SiCl4 were investigated in the gate recess process. SiCl4-etched devices showed higher channel mobility and lower threshold voltage. Atomic force microscope measurement was done to investigate the etching profile with different etching protection mask. Compared with photoresist, SiO2-masked sample showed lower surface roughness and better profile with stepper sidewall and weaker trenching effect resulting in higher channel mobility in the MOSFET.
Original language | English |
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Pages (from-to) | 151-155 |
Number of pages | 5 |
Journal | Frontiers of Materials Science |
Volume | 9 |
Issue number | 2 |
DOIs | |
Publication status | Published - Jun 26 2015 |
All Science Journal Classification (ASJC) codes
- Materials Science(all)