Abstract
Fast recovery characteristics can be obtained in the SiGe/Si/Si pin diodes compared to the conventional Si pin diodes without any intentional lifetime controls into the i-layer. This technique also makes little change in the on-state voltage drop (Vf), which suggests the low power dissipation with the fast operation in the switching circuits. It is highly possible that the thin SiGe p layer with the suppressed minority carrier lifetime enhances the diffusion current in the SiGe pin diode, where the stored minority carrier effectively decreases in the Si i-layer. It is also possible that the recombination of minority carrier at the interface of the SiGe and the metal layers increases the diffusion current in the pin diode.
Original language | English |
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Pages | 1015-1020 |
Number of pages | 6 |
Publication status | Published - 2004 |
Externally published | Yes |
Event | SiGe: Materials, Processing, and Devices - Proceedings of the First Symposium - Honolulu, HI, United States Duration: Oct 3 2004 → Oct 8 2004 |
Other
Other | SiGe: Materials, Processing, and Devices - Proceedings of the First Symposium |
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Country/Territory | United States |
City | Honolulu, HI |
Period | 10/3/04 → 10/8/04 |
All Science Journal Classification (ASJC) codes
- Engineering(all)