Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device

Yasuyuki Morita, Kazuo Arakawa, Mitsugu Todo, Masayuki Kaneto

    Research output: Contribution to journalArticlepeer-review

    12 Citations (Scopus)

    Abstract

    Moiré interferometry was used to analyze the thermal deformation of four flip-chip devices mounted on FR-4 substrate and a new multi-layer substrate, with and without underfill. Thermal loading was applied by cooling the devices from 100 °C to room temperature (25 °C). The effects of underfill and the low-CTE (coefficient of thermal expansion) substrate on thermal deformation were investigated. The experimental results showed that the underfill curved in a manner similar to the silicon chip. For the flip-chip devices mounted on the multi-layer substrate, the CTE mismatch between the silicon chip and substrate was reduced, and bending deformation decreased. Of the four flip-chip devices studied, the underfilled flip-chip device mounted on the multi-layer substrate had the least deformed solder balls.

    Original languageEnglish
    Pages (from-to)923-929
    Number of pages7
    JournalMicroelectronics Reliability
    Volume46
    Issue number5-6
    DOIs
    Publication statusPublished - May 2006

    All Science Journal Classification (ASJC) codes

    • Electronic, Optical and Magnetic Materials
    • Atomic and Molecular Physics, and Optics
    • Condensed Matter Physics
    • Safety, Risk, Reliability and Quality
    • Surfaces, Coatings and Films
    • Electrical and Electronic Engineering

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