Experimental study on the immersion cooling of an upward-facing multichip module with an opposing condensing surface

S. R. Tian; H. Takamatsu; H. Honda

Experimental study on the immersion cooling of an upward-facing multichip module with an opposing condensing surface

S. R. Tian, H. Takamatsu, H. Honda

Thermal Engineering

Research output: Contribution to conference › Paper › peer-review

1 Citation (Scopus)

Abstract

Heat transfer characteristics of a simulated immersion cooling module was studied experimentally. The test module consisted of three doped silicon chips mounted on a horizontal substrate and a downward-facing finned condenser with two-dimensional fins which were assembled in a rectangular box. FC-72 was used as a test fluid. Experimental data showing the effects of the space height between the chip surface and the fin tip, the fin spacing of the condensing surface, and the cooling water temperature on the boiling curve are presented.

Original language	English
Pages	206-211
Number of pages	6
Publication status	Published - 1996
Event	Proceedings of the 1996 4th International Symposium on Heat Transfer, ISHT - Beijing, China Duration: Oct 7 1996 → Oct 11 1996

Other

Other	Proceedings of the 1996 4th International Symposium on Heat Transfer, ISHT
City	Beijing, China
Period	10/7/96 → 10/11/96

All Science Journal Classification (ASJC) codes

General Engineering

Cite this

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title = "Experimental study on the immersion cooling of an upward-facing multichip module with an opposing condensing surface",

abstract = "Heat transfer characteristics of a simulated immersion cooling module was studied experimentally. The test module consisted of three doped silicon chips mounted on a horizontal substrate and a downward-facing finned condenser with two-dimensional fins which were assembled in a rectangular box. FC-72 was used as a test fluid. Experimental data showing the effects of the space height between the chip surface and the fin tip, the fin spacing of the condensing surface, and the cooling water temperature on the boiling curve are presented.",

author = "Tian, {S. R.} and H. Takamatsu and H. Honda",

year = "1996",

language = "English",

pages = "206--211",

note = "Proceedings of the 1996 4th International Symposium on Heat Transfer, ISHT ; Conference date: 07-10-1996 Through 11-10-1996",

}

TY - CONF

T1 - Experimental study on the immersion cooling of an upward-facing multichip module with an opposing condensing surface

AU - Tian, S. R.

AU - Takamatsu, H.

AU - Honda, H.

PY - 1996

Y1 - 1996

N2 - Heat transfer characteristics of a simulated immersion cooling module was studied experimentally. The test module consisted of three doped silicon chips mounted on a horizontal substrate and a downward-facing finned condenser with two-dimensional fins which were assembled in a rectangular box. FC-72 was used as a test fluid. Experimental data showing the effects of the space height between the chip surface and the fin tip, the fin spacing of the condensing surface, and the cooling water temperature on the boiling curve are presented.

AB - Heat transfer characteristics of a simulated immersion cooling module was studied experimentally. The test module consisted of three doped silicon chips mounted on a horizontal substrate and a downward-facing finned condenser with two-dimensional fins which were assembled in a rectangular box. FC-72 was used as a test fluid. Experimental data showing the effects of the space height between the chip surface and the fin tip, the fin spacing of the condensing surface, and the cooling water temperature on the boiling curve are presented.

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UR - http://www.scopus.com/inward/citedby.url?scp=0030379766&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:0030379766

SP - 206

EP - 211

T2 - Proceedings of the 1996 4th International Symposium on Heat Transfer, ISHT

Y2 - 7 October 1996 through 11 October 1996

ER -

Experimental study on the immersion cooling of an upward-facing multichip module with an opposing condensing surface

Abstract

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All Science Journal Classification (ASJC) codes

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