Experimental study on the immersion cooling of an upward-facing multichip module with an opposing condensing surface

Engineering

• Heat Transfer 100%
• Condenser 75%
• Performance 50%
• Substrates 50%
• Heat Flux 50%
• Cooling Water 50%
• Thin Films 25%
• Surfaces 25%
• Experiments 25%
• Modules 25%
• Multichip Modules 25%
• Test Section 25%
• Nucleate Boiling 25%
• Lower Wall 25%
• Silicon Surface 25%

Physics

• Region 75%
• Spacing 75%
• Substrates 50%
• Performance 50%
• Bubbles 50%
• Cooling 50%
• Cooling Water 50%
• Submerging 50%
• Thin Films 25%
• Silicon 25%
• Nucleate Boiling 25%
• Metal Surfaces 25%