TY - JOUR
T1 - Experimental study on the immersion cooling of an upward-facing multichip module with an opposing condensing surface
AU - Tian, Shu Rong
AU - Takamatsu, Hiroshi
AU - Honda, Hiroshi
PY - 1998
Y1 - 1998
N2 - The heat transfer characteristics of a simulated immersion cooling module were studied experimentally. The test module consisted of three doped silicon chips mounted on a horizontal substrate and a downward-facing finned condenser with rectangular fins that were assembled in a rectangular box. FC-72 was used as a test fluid. Experimental data showing the effects of the space height between the chip surface and the fin tip of the condenser, the fin spacing of the condenser, and the cooling water temperature on the boiling curve, are presented.
AB - The heat transfer characteristics of a simulated immersion cooling module were studied experimentally. The test module consisted of three doped silicon chips mounted on a horizontal substrate and a downward-facing finned condenser with rectangular fins that were assembled in a rectangular box. FC-72 was used as a test fluid. Experimental data showing the effects of the space height between the chip surface and the fin tip of the condenser, the fin spacing of the condenser, and the cooling water temperature on the boiling curve, are presented.
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U2 - 10.1002/(sici)1520-6556(1998)27:7<497::aid-htj3>3.0.co;2-z
DO - 10.1002/(sici)1520-6556(1998)27:7<497::aid-htj3>3.0.co;2-z
M3 - Article
AN - SCOPUS:0032464374
SN - 1099-2871
VL - 27
SP - 497
EP - 508
JO - Heat Transfer - Asian Research
JF - Heat Transfer - Asian Research
IS - 7
ER -