Evalution of drop strength due to thermal degradation for BGA-IC package

Young Bae Kim; Hiroshi Noguchi; Masazumi Amagai

doi:10.1299/kikaia.72.186

Evalution of drop strength due to thermal degradation for BGA-IC package

Young Bae Kim, Hiroshi Noguchi, Masazumi Amagai

Strength of materials

Research output: Contribution to journal › Review article › peer-review

Abstract

The effects of 125°C holding time on static strength of package solder ball and impact strength of package solder ball have been investigated for BGA-IC package with Pb-free solder or Pb solder. A solder ball failure can be divided into ductile failure of solder ball and interface failure between a copper and intermetallic compound. Results shows that aging time increases the ductile strength of solder ball in a package and decrease the interface strength of package. The impact strength of solder ball in a BGA package can be predicted from the static strength of solder ball. The predicted impact strength of solder ball was compared with the actual impact strength of solder ball. It shows good correlation.

Original language	English
Pages (from-to)	186-191
Number of pages	6
Journal	Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A
Volume	72
Issue number	2
DOIs	https://doi.org/10.1299/kikaia.72.186
Publication status	Published - Jan 1 2006

All Science Journal Classification (ASJC) codes

Materials Science(all)
Mechanics of Materials
Mechanical Engineering

Access to Document

10.1299/kikaia.72.186

Cite this

@article{f5cff36d74594de0a243704772919a8c,

title = "Evalution of drop strength due to thermal degradation for BGA-IC package",

abstract = "The effects of 125°C holding time on static strength of package solder ball and impact strength of package solder ball have been investigated for BGA-IC package with Pb-free solder or Pb solder. A solder ball failure can be divided into ductile failure of solder ball and interface failure between a copper and intermetallic compound. Results shows that aging time increases the ductile strength of solder ball in a package and decrease the interface strength of package. The impact strength of solder ball in a BGA package can be predicted from the static strength of solder ball. The predicted impact strength of solder ball was compared with the actual impact strength of solder ball. It shows good correlation.",

author = "Kim, {Young Bae} and Hiroshi Noguchi and Masazumi Amagai",

year = "2006",

month = jan,

day = "1",

doi = "10.1299/kikaia.72.186",

language = "English",

volume = "72",

pages = "186--191",

journal = "Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A",

issn = "0387-5008",

publisher = "一般社団法人日本機械学会",

number = "2",

}

TY - JOUR

T1 - Evalution of drop strength due to thermal degradation for BGA-IC package

AU - Kim, Young Bae

AU - Noguchi, Hiroshi

AU - Amagai, Masazumi

PY - 2006/1/1

Y1 - 2006/1/1

N2 - The effects of 125°C holding time on static strength of package solder ball and impact strength of package solder ball have been investigated for BGA-IC package with Pb-free solder or Pb solder. A solder ball failure can be divided into ductile failure of solder ball and interface failure between a copper and intermetallic compound. Results shows that aging time increases the ductile strength of solder ball in a package and decrease the interface strength of package. The impact strength of solder ball in a BGA package can be predicted from the static strength of solder ball. The predicted impact strength of solder ball was compared with the actual impact strength of solder ball. It shows good correlation.

AB - The effects of 125°C holding time on static strength of package solder ball and impact strength of package solder ball have been investigated for BGA-IC package with Pb-free solder or Pb solder. A solder ball failure can be divided into ductile failure of solder ball and interface failure between a copper and intermetallic compound. Results shows that aging time increases the ductile strength of solder ball in a package and decrease the interface strength of package. The impact strength of solder ball in a BGA package can be predicted from the static strength of solder ball. The predicted impact strength of solder ball was compared with the actual impact strength of solder ball. It shows good correlation.

UR - http://www.scopus.com/inward/record.url?scp=33645815696&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33645815696&partnerID=8YFLogxK

U2 - 10.1299/kikaia.72.186

DO - 10.1299/kikaia.72.186

M3 - Review article

AN - SCOPUS:33645815696

SN - 0387-5008

VL - 72

SP - 186

EP - 191

JO - Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

JF - Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

IS - 2

ER -

Evalution of drop strength due to thermal degradation for BGA-IC package

Abstract

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this