Electrodeposition of metallic tungsten films in ZnCl2-NaCl-KCl-KF-WO3 melt at 250 °C

Hironori Nakajima; Toshiyuki Nohira; Rika Hagiwara; Koji Nitta; Shinji Inazawa; Kazunori Okada

doi:10.1016/j.electacta.2007.04.082

Electrodeposition of metallic tungsten films in ZnCl₂-NaCl-KCl-KF-WO₃ melt at 250 °C

Hironori Nakajima, Toshiyuki Nohira, Rika Hagiwara, Koji Nitta, Shinji Inazawa, Kazunori Okada

Research output: Contribution to journal › Article › peer-review

25 Citations (Scopus)

Abstract

WO₃ hardly dissolved in ZnCl₂-NaCl-KCl (0.60:0.20:0.20, in mole fraction) melt at 250 °C. The solubility of WO₃ increased by the addition of KF to the melt, which enabled electrodeposition of metallic tungsten. A smooth and fine film of metallic tungsten was obtained on a nickel substrate by the potentiostatic electrolysis at 0.06 V versus Zn(II)/Zn. The thickness reached ca. 2.5 μm after 6-h electrolysis. The surface of the nickel contact probe pin manufactured by the conventional LIGA (Lithographie-Galvanoformung-Abformung, German abbreviation) process was successfully coated with a smooth and adhesive tungsten film by using this melt.

Original language	English
Pages (from-to)	24-27
Number of pages	4
Journal	Electrochimica Acta
Volume	53
Issue number	1
DOIs	https://doi.org/10.1016/j.electacta.2007.04.082
Publication status	Published - Nov 20 2007
Externally published	Yes

All Science Journal Classification (ASJC) codes

Chemical Engineering(all)
Electrochemistry

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10.1016/j.electacta.2007.04.082

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title = "Electrodeposition of metallic tungsten films in ZnCl2-NaCl-KCl-KF-WO3 melt at 250 °C",

abstract = "WO3 hardly dissolved in ZnCl2-NaCl-KCl (0.60:0.20:0.20, in mole fraction) melt at 250 °C. The solubility of WO3 increased by the addition of KF to the melt, which enabled electrodeposition of metallic tungsten. A smooth and fine film of metallic tungsten was obtained on a nickel substrate by the potentiostatic electrolysis at 0.06 V versus Zn(II)/Zn. The thickness reached ca. 2.5 μm after 6-h electrolysis. The surface of the nickel contact probe pin manufactured by the conventional LIGA (Lithographie-Galvanoformung-Abformung, German abbreviation) process was successfully coated with a smooth and adhesive tungsten film by using this melt.",

author = "Hironori Nakajima and Toshiyuki Nohira and Rika Hagiwara and Koji Nitta and Shinji Inazawa and Kazunori Okada",

note = "Funding Information: This study was supported by Industrial Technology Research Grant Program in 2003 from the New Energy and Industrial Technology Development Organization (NEDO) of Japan. ",

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doi = "10.1016/j.electacta.2007.04.082",

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T1 - Electrodeposition of metallic tungsten films in ZnCl2-NaCl-KCl-KF-WO3 melt at 250 °C

AU - Nakajima, Hironori

AU - Nohira, Toshiyuki

AU - Hagiwara, Rika

AU - Nitta, Koji

AU - Inazawa, Shinji

AU - Okada, Kazunori

N1 - Funding Information: This study was supported by Industrial Technology Research Grant Program in 2003 from the New Energy and Industrial Technology Development Organization (NEDO) of Japan.

PY - 2007/11/20

Y1 - 2007/11/20

N2 - WO3 hardly dissolved in ZnCl2-NaCl-KCl (0.60:0.20:0.20, in mole fraction) melt at 250 °C. The solubility of WO3 increased by the addition of KF to the melt, which enabled electrodeposition of metallic tungsten. A smooth and fine film of metallic tungsten was obtained on a nickel substrate by the potentiostatic electrolysis at 0.06 V versus Zn(II)/Zn. The thickness reached ca. 2.5 μm after 6-h electrolysis. The surface of the nickel contact probe pin manufactured by the conventional LIGA (Lithographie-Galvanoformung-Abformung, German abbreviation) process was successfully coated with a smooth and adhesive tungsten film by using this melt.

AB - WO3 hardly dissolved in ZnCl2-NaCl-KCl (0.60:0.20:0.20, in mole fraction) melt at 250 °C. The solubility of WO3 increased by the addition of KF to the melt, which enabled electrodeposition of metallic tungsten. A smooth and fine film of metallic tungsten was obtained on a nickel substrate by the potentiostatic electrolysis at 0.06 V versus Zn(II)/Zn. The thickness reached ca. 2.5 μm after 6-h electrolysis. The surface of the nickel contact probe pin manufactured by the conventional LIGA (Lithographie-Galvanoformung-Abformung, German abbreviation) process was successfully coated with a smooth and adhesive tungsten film by using this melt.

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Electrodeposition of metallic tungsten films in ZnCl₂-NaCl-KCl-KF-WO₃ melt at 250 °C

Abstract

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