Electrochemical processing of Cu and Ni nanowire arrays

Munekazu Motoyama, Yasuhiro Fukunaka, Tetsuo Sakka, Yukio H. Ogata, Shiomi Kikuchi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Cu and Ni nanowire arrays were fabricated by potentiostatic electrodeposition into polycarbonate (PC) track-etched membranes with nano-sized cylindrical pores. The pore diameters of the membranes were from 15 to 200 run. The transient current variation can be divided into four stages during the growth of Cu and Ni nanowires. The nanowires were observed with FE-SEM and TEM. The length was controlled by the thickness of membranes. The aspect ratio reached more than 50. However, the diameters of wires were not perfectly uniform along the length. In the case of nanowire with 15 nm diam, the knurled shape was observed on its side. Such morphology did not depend on the overpotential and the type of metal, Cu or Ni. It may be attributed to the original shape of the pore wall in PC membranes track-etched with heavy ion.

Original languageEnglish
Title of host publicationPits and Pores III
Subtitle of host publicationFormation, Properties, and Significance for Advanced Materials - Proceedings of the International Symposium
Pages99-108
Number of pages10
Publication statusPublished - 2006
Externally publishedYes
Event206th Electrochemical Society Meeting - Honolulu, HI, United States
Duration: Oct 3 2004Oct 8 2004

Publication series

NameProceedings - Electrochemical Society
VolumePV 2004-19

Conference

Conference206th Electrochemical Society Meeting
Country/TerritoryUnited States
CityHonolulu, HI
Period10/3/0410/8/04

All Science Journal Classification (ASJC) codes

  • General Engineering

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