Effect of working fluids on cut-off grinding of silicon by outer blade

Kazuhiko Koshima, Hiromichi Onikura, Takao Sajima

Research output: Contribution to journalArticlepeer-review


Machining a brittle material blank into a final product, cut-off grinding process, i.e. slicing process producing the wafers from silicon ingot or dicing process dividing the wafer into chips, is one of the important machining methods. The present research aims at clarifying the influence of the working fluids on grindability, and the cloudy point of soluble oil in cut-off grinding of silicon blocks by outer blade saw. The cut-off grinding force, the mechanical damage and the warp are smaller when using working fluids having low viscosity and excellent osmolarity than that of the working fluids having superior lubrication property but high viscosity. The amount and its dispersion of mechanical damage when using oil-based fluids are lower than that of water-based fluids. In relation to the soluble oil cloudy point, the cut-off ground surface roughness and the warp are smaller but the grinding force is high for a temperature lower than the cloudy point in comparison to a temperature higher than the cloudy point.

Original languageEnglish
Pages (from-to)67-78
Number of pages12
JournalMemoirs of the Faculty of Engineering, Kyushu University
Issue number1
Publication statusPublished - Mar 2003
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • General Energy
  • Atmospheric Science
  • General Earth and Planetary Sciences
  • Management of Technology and Innovation


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