Abstract
Contribution of recoil atoms to the spatial distribution of total energy deposited by ions impinging in silicon is evaluated for 10-250 keV B and Ar ions. The calculated results are compared with the damaged layer thickness obtained by the ion-bombardment-enhanced selective etching, and the effect of energy transport with recoil atoms (recoil atom effect) on deposited energy distributions is discussed.
Original language | English |
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Pages (from-to) | 219-223 |
Number of pages | 5 |
Journal | Research Reports on Information Science and Electrical Engineering of Kyushu University |
Volume | 2 |
Issue number | 2 |
Publication status | Published - Sept 1997 |
All Science Journal Classification (ASJC) codes
- Computer Science(all)
- Electrical and Electronic Engineering