Effect of Coating Self-Assembled Monolayer on Room-Temperature Bonding of Cu Micro-Interconnects

Lising Qiu, Akihiro Ikeda, Tanemasa Asano

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	068004-1-3
Journal	Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
Volume	52
Issue number	6
Publication status	Published - Jun 2013

Cite this

@article{a0ecef6086e5448e8f3ab80561db1fcc,

title = "Effect of Coating Self-Assembled Monolayer on Room-Temperature Bonding of Cu Micro-Interconnects",

author = "Lising Qiu and Akihiro Ikeda and Tanemasa Asano",

year = "2013",

month = jun,

language = "English",

volume = "52",

pages = "068004--1--3",

journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",

issn = "0021-4922",

publisher = "Institute of Physics",

number = "6",

}

TY - JOUR

T1 - Effect of Coating Self-Assembled Monolayer on Room-Temperature Bonding of Cu Micro-Interconnects

AU - Qiu, Lising

AU - Ikeda, Akihiro

AU - Asano, Tanemasa

PY - 2013/6

Y1 - 2013/6

M3 - Article

SN - 0021-4922

VL - 52

SP - 068004-1-3

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

IS - 6

ER -