Effect of coating self-assembled monolayer on room-temperature bonding of Cu micro-interconnects

Lijing Qiu; Akihiro Ikeda; Tanemasa Asano

doi:10.7567/JJAP.52.068004

Effect of coating self-assembled monolayer on room-temperature bonding of Cu micro-interconnects

Lijing Qiu, Akihiro Ikeda, Tanemasa Asano

Integrated Electronic Systems

Research output: Contribution to journal › Review article › peer-review

3 Citations (Scopus)

Abstract

The effect of coating the surface of a Cu microbump with a 1-hexanethiol self-assembled monolayer (SAM) on room-temperature solid-phase bonding was investigated. The microbump was cone-shaped while the counterelectrode was planar. Room-temperature bonding was performed by applying ultrasonic vibration. Chemical analysis showed that the SAM coating suppressed the surface oxidation of Cu. However, it was shown that the SAM coating also reduced the mechanical strength of the bonded interface, whereas little effect was observed in the electrical resistance of bump interconnects.

Original language	English
Article number	068004
Journal	Japanese journal of applied physics
Volume	52
Issue number	6 PART 1
DOIs	https://doi.org/10.7567/JJAP.52.068004
Publication status	Published - Jun 2013

All Science Journal Classification (ASJC) codes

Engineering(all)
Physics and Astronomy(all)

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abstract = "The effect of coating the surface of a Cu microbump with a 1-hexanethiol self-assembled monolayer (SAM) on room-temperature solid-phase bonding was investigated. The microbump was cone-shaped while the counterelectrode was planar. Room-temperature bonding was performed by applying ultrasonic vibration. Chemical analysis showed that the SAM coating suppressed the surface oxidation of Cu. However, it was shown that the SAM coating also reduced the mechanical strength of the bonded interface, whereas little effect was observed in the electrical resistance of bump interconnects.",

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AU - Ikeda, Akihiro

AU - Asano, Tanemasa

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N2 - The effect of coating the surface of a Cu microbump with a 1-hexanethiol self-assembled monolayer (SAM) on room-temperature solid-phase bonding was investigated. The microbump was cone-shaped while the counterelectrode was planar. Room-temperature bonding was performed by applying ultrasonic vibration. Chemical analysis showed that the SAM coating suppressed the surface oxidation of Cu. However, it was shown that the SAM coating also reduced the mechanical strength of the bonded interface, whereas little effect was observed in the electrical resistance of bump interconnects.

AB - The effect of coating the surface of a Cu microbump with a 1-hexanethiol self-assembled monolayer (SAM) on room-temperature solid-phase bonding was investigated. The microbump was cone-shaped while the counterelectrode was planar. Room-temperature bonding was performed by applying ultrasonic vibration. Chemical analysis showed that the SAM coating suppressed the surface oxidation of Cu. However, it was shown that the SAM coating also reduced the mechanical strength of the bonded interface, whereas little effect was observed in the electrical resistance of bump interconnects.

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IS - 6 PART 1

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Effect of coating self-assembled monolayer on room-temperature bonding of Cu micro-interconnects

Abstract

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