TY - JOUR
T1 - Effect of argon/hydrogen plasma cleaning on electroless ni deposition on small-area al pads
AU - Ikeda, Akihiro
AU - Kajiwara, Kouhei
AU - Watanabe, Naoya
AU - Asano, Tanemasa
PY - 2010/8
Y1 - 2010/8
N2 - We investigated effect of Ar/H2 plasma cleaning on electroless Ni under-bump metallurgy (UBM) layer formation on small-area Al pads. When 5 × 5 μm2 pads are cleaned with the plasma, electroless Ni grows successfully on them, whereas no growth occurs on pads cleaned with conventional wet chemicals. In the Ni-UBM layer formation process, Zn is deposited by displacement plating on the Al pads before the electroless Ni plating. Microscopic observations, however, reveal that Zn is not successfully deposited on the wet-cleaned Al-pad surface. X-ray chemical analysis indicates that the plasma cleaning effectively removes C contaminations even for small pad sizes.
AB - We investigated effect of Ar/H2 plasma cleaning on electroless Ni under-bump metallurgy (UBM) layer formation on small-area Al pads. When 5 × 5 μm2 pads are cleaned with the plasma, electroless Ni grows successfully on them, whereas no growth occurs on pads cleaned with conventional wet chemicals. In the Ni-UBM layer formation process, Zn is deposited by displacement plating on the Al pads before the electroless Ni plating. Microscopic observations, however, reveal that Zn is not successfully deposited on the wet-cleaned Al-pad surface. X-ray chemical analysis indicates that the plasma cleaning effectively removes C contaminations even for small pad sizes.
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U2 - 10.1143/JJAP.49.08JA05
DO - 10.1143/JJAP.49.08JA05
M3 - Article
AN - SCOPUS:77958100253
SN - 0021-4922
VL - 49
JO - Japanese journal of applied physics
JF - Japanese journal of applied physics
IS - 8 PART 2
M1 - 08JA05
ER -