TY - JOUR
T1 - Direct simulation of flowing colloidal dispersions by smoothed profile method
AU - Nakayama, Yasuya
AU - Kim, Kang
AU - Yamamoto, Ryoichi
N1 - Funding Information:
This work was supported by the FY 2002-2005 PRESTO of Japan Science and Technology Agency (JST).
PY - 2010/3
Y1 - 2010/3
N2 - We developed a simulation scheme to predict the dynamic behavior of colloidal dispersion called "smoothed profile (SP) method". SP method provides a coupling scheme between continuum fluid dynamics and rigid-body dynamics through smoothed profile of colloidal particles. Moreover, SP method can incorporate multi-component fluids, such systems as charged colloids in electrolyte solutions. Numerical results which assess hydrodynamic interactions of colloidal dispersions are presented to validate SP method. Application of SP method is not restricted to a Newtonian solvent, but any constitutive model can be handled. Henceforth, it can be suitable to treat colloidal dispersions in complex fluids where solvent-mediated interaction dominate dynamical behaviors of colloids.
AB - We developed a simulation scheme to predict the dynamic behavior of colloidal dispersion called "smoothed profile (SP) method". SP method provides a coupling scheme between continuum fluid dynamics and rigid-body dynamics through smoothed profile of colloidal particles. Moreover, SP method can incorporate multi-component fluids, such systems as charged colloids in electrolyte solutions. Numerical results which assess hydrodynamic interactions of colloidal dispersions are presented to validate SP method. Application of SP method is not restricted to a Newtonian solvent, but any constitutive model can be handled. Henceforth, it can be suitable to treat colloidal dispersions in complex fluids where solvent-mediated interaction dominate dynamical behaviors of colloids.
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U2 - 10.1016/j.apt.2009.11.011
DO - 10.1016/j.apt.2009.11.011
M3 - Article
AN - SCOPUS:77950980962
SN - 0921-8831
VL - 21
SP - 206
EP - 211
JO - Advanced Powder Technology
JF - Advanced Powder Technology
IS - 2
ER -