Development of novel groove patterns for CMP pad

Tsutomu Yamazaki, Toshiro K. Doi, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda, Kiyoshi Seshimo, Hideo Aida

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)


This study aims to develop the CMP pads that have new groove pattern as control the slurry flow. We have been proposed two type groove patterns as inflow type and outflow type. Here, it is well known that the slurry flow is remarkably important as both to use the slurry effectively and to reduction the slurry quantity consumed of CeO 2 abrasive that is one of rare metals. This paper describes the effect of groove pattern on the slurry flow from the observation image with high-speed camera. In particular, the slurry flow is quantitatively visualized by digital image processing. As a result, the several advantages of both proposed inflow type and outflow type show from a view point of slurry flow compared to the conventional XY-groove pad and No-groove pad.

Original languageEnglish
Title of host publicationUltra-Precision Machining Technologies
Number of pages4
Publication statusPublished - 2012
Event8th CHINA-JAPAN International Conference on Ultra-Precision Machining, CJUPM 2011 - Hangzhou City, China
Duration: Nov 20 2011Nov 22 2011

Publication series

NameAdvanced Materials Research
ISSN (Print)1022-6680


Other8th CHINA-JAPAN International Conference on Ultra-Precision Machining, CJUPM 2011
CityHangzhou City

All Science Journal Classification (ASJC) codes

  • General Engineering


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