This paper presents the development of a high-efficient class-E power amplifier (PA) module for 5-GHz wireless transmitter applications using constant envelope modulation scheme in a 0.18-μm CMOS technology. This PA was placed on the lead frame and molded in the packaging for transmitter application. In our design, bonding wires are optimized by using electro-magnetic simulation. And the coplanar waveguide structure was composed of bonding wires at the RF port. Furthermore, in order to reduce the chip size and metal loss, spiral inductors were replaced by bonding wire on chip. We fabricated this PA module and measured saturated output power and maximum power-added-efficiency (PAE) at 5 GHz-band. The measured saturated output power is 17.6 dBm at 5.2GHz.
|Title of host publication
|2015 IEEE 17th Electronics Packaging and Technology Conference, EPTC 2015
|Institute of Electrical and Electronics Engineers Inc.
|Published - Feb 17 2016
|17th IEEE Electronics Packaging and Technology Conference, EPTC 2015 - Singapore, Singapore
Duration: Dec 2 2015 → Dec 4 2015
|Proceedings of the Electronic Packaging Technology Conference, EPTC
|17th IEEE Electronics Packaging and Technology Conference, EPTC 2015
|12/2/15 → 12/4/15
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics