TY - JOUR
T1 - Development of an AC electric field-applied tribochemical polishing technology to promote high-efficiency polishing for glass substrates (image analysis of dynamical slurry behaviours and polishing characteristics under AC electric field)
AU - Ikeda, Hiroshi
AU - Akagami, Yoichi
AU - Uneda, Michio
AU - Ohnishi, Osamu
AU - Kurokawa, Syuhei
AU - Doi, Toshiro K.
PY - 2012
Y1 - 2012
N2 - This paper deals with the investigation conducted on the mechanism of the polishing technology, to which AC electric field is applied. For the analysis of the slurry dynamical behaviors, we used a digital image processor. In this research, we have also worked to develop a novel high-efficiency polishing technology applying AC electric field for the glass substrates for IT devices. When AC electric field was applied to, the slurry behavior was found to have better stability than the one without AC electric field. Furthermore, good polishing rates were obtained under high-relative rotation speed between the glass substrates and polishing pad. This suggests that the friction heat generated between the glass substrate and polishing pad, which promote tribochemical reactions, improves polishing rate. This latest polishing technology makes the removal rate two times better than the conventional polishing and produces excellently smooth surface.
AB - This paper deals with the investigation conducted on the mechanism of the polishing technology, to which AC electric field is applied. For the analysis of the slurry dynamical behaviors, we used a digital image processor. In this research, we have also worked to develop a novel high-efficiency polishing technology applying AC electric field for the glass substrates for IT devices. When AC electric field was applied to, the slurry behavior was found to have better stability than the one without AC electric field. Furthermore, good polishing rates were obtained under high-relative rotation speed between the glass substrates and polishing pad. This suggests that the friction heat generated between the glass substrate and polishing pad, which promote tribochemical reactions, improves polishing rate. This latest polishing technology makes the removal rate two times better than the conventional polishing and produces excellently smooth surface.
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U2 - 10.1299/kikaic.78.986
DO - 10.1299/kikaic.78.986
M3 - Article
AN - SCOPUS:84859621554
SN - 0387-5024
VL - 78
SP - 986
EP - 995
JO - Nihon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
JF - Nihon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
IS - 787
ER -