TY - GEN
T1 - Design of electrostatic adhesion device using the flexible electrodes
AU - Takada, Akifumi
AU - Nakamura, Shingo
AU - Yamanishi, Yoko
AU - Hashimura, Shinji
AU - Nagasawa, Sumito
AU - Kogure, Takanobu
AU - Maeda, Shingo
PY - 2015/1/9
Y1 - 2015/1/9
N2 - This paper presents a fabrication method of electrostatic adhesion device using flexible electrodes. When an electric charge is stored in the bipolar plate of a capacitor, an electrostatic force acts. We perform adhesion to a wall surface using this electrostatic force. Using the electrostatic force, electrostatic adhesion force is controlled by the electricity. The flexible electrodes are created by spraying a solution containing dispersed carbon black onto a silicon rubber. Flexibility of the device can avoid damage to its own and adapt to a variety of wall surface shapes. In experiments, two kinds of device surface structures were created. One is just flat and the other is pillar arrays. The pillar arrays structure was adopted from the viewpoint of biomimetic. Electrostatic adhesion force of these structures was measured with shear and tensile testing machines.
AB - This paper presents a fabrication method of electrostatic adhesion device using flexible electrodes. When an electric charge is stored in the bipolar plate of a capacitor, an electrostatic force acts. We perform adhesion to a wall surface using this electrostatic force. Using the electrostatic force, electrostatic adhesion force is controlled by the electricity. The flexible electrodes are created by spraying a solution containing dispersed carbon black onto a silicon rubber. Flexibility of the device can avoid damage to its own and adapt to a variety of wall surface shapes. In experiments, two kinds of device surface structures were created. One is just flat and the other is pillar arrays. The pillar arrays structure was adopted from the viewpoint of biomimetic. Electrostatic adhesion force of these structures was measured with shear and tensile testing machines.
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U2 - 10.1109/MHS.2014.7006081
DO - 10.1109/MHS.2014.7006081
M3 - Conference contribution
AN - SCOPUS:84961381681
T3 - 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014
BT - 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014
Y2 - 10 November 2014 through 12 November 2014
ER -