TY - GEN
T1 - Design concept of n-buffer layer (n-Bottom Assist Layer) for 600V-class semi-super junction MOSFET
AU - Ono, Syotaro
AU - Saito, Wataru
AU - Takashita, Masakatsu
AU - Kurushima, Shoichiro
AU - Tokano, Ken'ichi
AU - Yamaguchi, Masakazu
PY - 2007
Y1 - 2007
N2 - We report the experimental results detailed about the n-buffer layer (n-BAL: n-Bottom Assist Layer) of 600V-class Semi-SJ MOSFET, and discuss about the design optimization by comparing the trade-off characteristics between the specific on-resistance (RonA) and the breakdown voltage (V B), the avalanche capability and the body diode characteristic for the first time. As design parameters, the thickness ratio TBAL-ratio and the doping concentration NBAL were varied in this work. As a result, the VB=750V, the RonA=24.6mΩcm2, the maximum avalanche current density JAP=292A/cm2 (I AP=7.6A, EAS=1.25J/cm2), and softness factor=0.277 were obtained with the structure of TBAL-ratio=27% and NBAL=1.0×1015 cm-3. The demonstration results showed that NPT (Non Punch Through)-type design (with high T BAL-ratio and high NBAL) realized the larger avalanche capability and the softer reverse recovery characteristic compared with PT (Punch Through)-type design.
AB - We report the experimental results detailed about the n-buffer layer (n-BAL: n-Bottom Assist Layer) of 600V-class Semi-SJ MOSFET, and discuss about the design optimization by comparing the trade-off characteristics between the specific on-resistance (RonA) and the breakdown voltage (V B), the avalanche capability and the body diode characteristic for the first time. As design parameters, the thickness ratio TBAL-ratio and the doping concentration NBAL were varied in this work. As a result, the VB=750V, the RonA=24.6mΩcm2, the maximum avalanche current density JAP=292A/cm2 (I AP=7.6A, EAS=1.25J/cm2), and softness factor=0.277 were obtained with the structure of TBAL-ratio=27% and NBAL=1.0×1015 cm-3. The demonstration results showed that NPT (Non Punch Through)-type design (with high T BAL-ratio and high NBAL) realized the larger avalanche capability and the softer reverse recovery characteristic compared with PT (Punch Through)-type design.
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U2 - 10.1109/ISPSD.2007.4294923
DO - 10.1109/ISPSD.2007.4294923
M3 - Conference contribution
AN - SCOPUS:39749101652
SN - 1424410959
SN - 9781424410958
T3 - Proceedings of the International Symposium on Power Semiconductor Devices and ICs
SP - 25
EP - 28
BT - Proceedings of 19th International Symposium on Power Semiconductor Devices and ICs, ISPSD'07
T2 - 19th International Symposium on Power Semiconductor Devices and ICs, ISPSD'07
Y2 - 27 May 2007 through 31 May 2007
ER -