TY - GEN
T1 - Dependence of Ti/C ratio on Ohmic contact with tic electrode for AlGaN/GaN structure
AU - Okamoto, M.
AU - Kakushima, K.
AU - Kataoka, Y.
AU - Nishiyama, A.
AU - Sugii, N.
AU - Wakabayashi, H.
AU - Tsutsui, K.
AU - Iwai, H.
AU - Saito, W.
PY - 2014/11/20
Y1 - 2014/11/20
N2 - The dependency of Ti atom composition in Ti-C mixed electrodes on Ohmic characteristics for AlGaN/GaN structure is examined by elucidating the role of both Ti and C atoms. Owing to AlGaN surface reduction by reaction with C atoms with thermal treatment, an enhanced reaction of Ti atoms and AlGaN layer has been confirmed. The border of reactive layer and the remaining AlGaN layer has shown rather uniform interface, which is contrast to conventional metallic spike formation. Higher Ti atom composition has revealed lower Ohmic contact resistance, especially 2.6 Ωmm with Ti:C of 5:1. The proposed reaction mechanism gives a new guideline to achieve uniform electron conduction for lower contact resistance.
AB - The dependency of Ti atom composition in Ti-C mixed electrodes on Ohmic characteristics for AlGaN/GaN structure is examined by elucidating the role of both Ti and C atoms. Owing to AlGaN surface reduction by reaction with C atoms with thermal treatment, an enhanced reaction of Ti atoms and AlGaN layer has been confirmed. The border of reactive layer and the remaining AlGaN layer has shown rather uniform interface, which is contrast to conventional metallic spike formation. Higher Ti atom composition has revealed lower Ohmic contact resistance, especially 2.6 Ωmm with Ti:C of 5:1. The proposed reaction mechanism gives a new guideline to achieve uniform electron conduction for lower contact resistance.
UR - http://www.scopus.com/inward/record.url?scp=84918531095&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84918531095&partnerID=8YFLogxK
U2 - 10.1109/WiPDA.2014.6964631
DO - 10.1109/WiPDA.2014.6964631
M3 - Conference contribution
AN - SCOPUS:84918531095
T3 - 2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014
SP - 94
EP - 97
BT - 2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2nd IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2014
Y2 - 13 October 2014 through 15 October 2014
ER -