@inproceedings{b906e42fe12b44a5889e0f18f03766a5,
title = "D2W Hybrid Bonding System Achieving High-Accuracy and High-Throughput With Minimal Configurations",
abstract = "The effectiveness of a new D2W hybrid bonder achieving 2200 UPH and 100-nm alignment accuracy is validated based on the fact that multiple chips are bonded even when the duration after plasma activation is fixed. Our hybrid bonding is characterized using Positron Annihilation Spectroscopy (PAS), Double Canti-lever Beam Method (DCBM) test, and TEG chips with Kelvin patterns to evaluate the electrical properties of Cu-Cu single joints/daisy chains. We confirm that excellent electrical properties are obtained from optimized Cu-CMP, pretreatment processes, including dicing, cleaning and plasma activation, and bonding conditions.",
keywords = "D2W hybrid bonding, DCBM, HO plasma, PAS, high-accuracy, high-throughput",
author = "Kentaro Mihara and Takashi Hare and Hirofumi Sakai and Shimpei Aoki and Toyoharu Terada and Mariappan Murugesan and Hiryuki Hashimoto and Hisashi Kino and Tetsu Tanaka and Takafumi Fukushima and Fumihiro Inoue and Akira Uedono",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 74th IEEE Electronic Components and Technology Conference, ECTC 2024 ; Conference date: 28-05-2024 Through 31-05-2024",
year = "2024",
doi = "10.1109/ECTC51529.2024.00074",
language = "English",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "420--426",
booktitle = "Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024",
address = "United States",
}