Cyclic creep behavior of SiCw/6061Al composites at high temperatures

P. L. Liu, Z. G. Wang, H. Toda, T. Kobayashi

Research output: Contribution to journalArticlepeer-review


The tensile creep and tensile-tensile cyclic creep behavior of 15 vol % and 28 vol % SiCw/6061 Al composites at different temperatures has been investigated and analyzed. The comparison between cyclic and static creep behavior indicates that the cyclic creep acceleration behavior is more likely to take place at lower temperatures. It is also found that the unloading amount affects the minimum creep rate significantly at the tested temperatures. The minimum cyclic creep rate decreases first and then increases with increasing the unloading amount. The unloading amount corresponding to the turning point of the minimum cyclic creep rates increases with increasing the temperature. Based on the concept of the back movement of dislocations during unloading portion, this result can be explained.

Original languageEnglish
Pages (from-to)655-660
Number of pages6
JournalKey Engineering Materials
Issue number149 PART II
Publication statusPublished - 1998
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering


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