Crystal distortion associated with ortho-tetra transition of REBa 2Cu3Ox films

M. Mukaida, M. Miura, A. Ichinose, S. Horii, K. Matsumoto, Y. Yoshida, K. Koike, Y. Takahashi, A. Saito, S. Ohshima

    Research output: Contribution to journalConference articlepeer-review

    1 Citation (Scopus)

    Abstract

    Microstructure deformation has been investigated for EuBa 2Cu3Ox films associated with orthorhombic-tetragonal transition during cooling in an oxygen atmosphere. EuBa2Cu3Ox films have been grown by a pulsed laser deposition technique under 1000 mTorr oxygen pressure and 800 °C substrate temperature. After the growth, the films are cooled to 400 °C and annealed in one atom oxygen pressure for 0-110 h. The preferred orientation of the films is characterized by X-ray diffraction and φ-scan X-ray diffraction. Microstructures and lattice images of the EuBa2Cu 3Ox films are observed by a transmission electron microscope. All of the obtained EuBa2Cu3Ox films are c-axis oriented. The φ-scan X-ray diffraction revealed that films without any 500 °C annealing have a tetragonal structure. However, more than 3 h annealed films are partly orthorhombic from the peak separation in the φ-scan. The angle between the two peaks is about 0.8°. We estimate the a-axis length/b-axis length ratio (orthorhombicity) from the angle between the separated peaks to be 0.866°. It agrees with the a-axis length/b-axis length ratio of well oxidized EuBa2Cu3Ox bulk materials.

    Original languageEnglish
    Pages (from-to)1010-1014
    Number of pages5
    JournalPhysica C: Superconductivity and its applications
    Volume426-431
    Issue numberII
    DOIs
    Publication statusPublished - 2005
    EventProceedings of the 17th Internatioanl Symposium on Superconductivity (ISS 2004) Advances in Superconductivity -
    Duration: Nov 23 2004Nov 25 2004

    All Science Journal Classification (ASJC) codes

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Energy Engineering and Power Technology
    • Electrical and Electronic Engineering

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