Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

K. Nogita; C. M. Gourlay; T. Nishimura

doi:10.1007/s11837-009-0087-6

Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

K. Nogita, C. M. Gourlay, T. Nishimura

Research output: Contribution to journal › Article › peer-review

123 Citations (Scopus)

Abstract

A method of limiting cracking in the Cu₆Sn₅ intermetallic compounds (IMCs) at the interface between lead-free solders and copper substrates has been developed. To explore the mechanism of crack inhibition in the nickel-containing IMC reaction layers, detailed synchrotron x-ray powder diffraction with Rietveld analysis and differential scanning calorimetry have been used. The results show that nickel stabilizes the high-temperature hexagonal allotrope of Cu6Sn5, avoiding stresses induced by a volumetric change that would otherwise occur on transformation to the monoclinic phase.

Original language	English
Pages (from-to)	45-51
Number of pages	7
Journal	JOM
Volume	61
Issue number	6
DOIs	https://doi.org/10.1007/s11837-009-0087-6
Publication status	Published - 2009
Externally published	Yes

All Science Journal Classification (ASJC) codes

Materials Science(all)
Engineering(all)

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10.1007/s11837-009-0087-6

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abstract = "A method of limiting cracking in the Cu6Sn5 intermetallic compounds (IMCs) at the interface between lead-free solders and copper substrates has been developed. To explore the mechanism of crack inhibition in the nickel-containing IMC reaction layers, detailed synchrotron x-ray powder diffraction with Rietveld analysis and differential scanning calorimetry have been used. The results show that nickel stabilizes the high-temperature hexagonal allotrope of Cu6Sn5, avoiding stresses induced by a volumetric change that would otherwise occur on transformation to the monoclinic phase.",

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AU - Gourlay, C. M.

AU - Nishimura, T.

PY - 2009

Y1 - 2009

N2 - A method of limiting cracking in the Cu6Sn5 intermetallic compounds (IMCs) at the interface between lead-free solders and copper substrates has been developed. To explore the mechanism of crack inhibition in the nickel-containing IMC reaction layers, detailed synchrotron x-ray powder diffraction with Rietveld analysis and differential scanning calorimetry have been used. The results show that nickel stabilizes the high-temperature hexagonal allotrope of Cu6Sn5, avoiding stresses induced by a volumetric change that would otherwise occur on transformation to the monoclinic phase.

AB - A method of limiting cracking in the Cu6Sn5 intermetallic compounds (IMCs) at the interface between lead-free solders and copper substrates has been developed. To explore the mechanism of crack inhibition in the nickel-containing IMC reaction layers, detailed synchrotron x-ray powder diffraction with Rietveld analysis and differential scanning calorimetry have been used. The results show that nickel stabilizes the high-temperature hexagonal allotrope of Cu6Sn5, avoiding stresses induced by a volumetric change that would otherwise occur on transformation to the monoclinic phase.

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Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

Abstract

All Science Journal Classification (ASJC) codes

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