Abstract
The tensile tests of copper performed on copper foil samples conditioned at 125°C for one hour and tested in accordance with test method IPC-TM-650, found the dependence of the rate of copper dissolution in lead-free soldering on the physical characteristics of the electroplated copper. A total of 10 copper foils were evaluated and four tensile specimens were prepared and tested from each supplier and the results were averaged. The 10 samples tested demonstrated initial erosion rates ranging between 0.175 μm/sec to 1.04 μm/sec. Considerable differences in the grain structures, appearances, mechanical properties and erodibility of the 10 electrodeposited copper samples is also observed. The differences in the erosion rates of copper from different suppliers varied by up to a factor of 1.7, while no strong correlations are identified between erosion rate, grain structure, and tensile properties.
| Original language | English |
|---|---|
| Pages (from-to) | 35-37 |
| Number of pages | 3 |
| Journal | Printed Circuit Design and Fab |
| Volume | 25 |
| Issue number | 10 |
| Publication status | Published - Oct 2008 |
| Externally published | Yes |
All Science Journal Classification (ASJC) codes
- Industrial relations
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering
- Management of Technology and Innovation
