Three-dimensional integration with through silicon vias offers a promising solution for future technology nodes. However, the heat accumulation and thermal strain may seriously affect performance, leakage, and reliability of circuits. The cross-plane thermal transport, generation, and propagation of coherent acoustic-phonon wave in thin Pt film-glass substrate have been comprehensively studied by applying the picosecond laser pump-probe method with different configurations. Significantly different time-dependent reflectance signals have been obtained in different configurations and an effect superposition model is proposed to account for cross plane thermal transport inducing ipsi- and contralateral temperature change in thin Pt film, propagation of coherent acoustic-phonon wave in thin Pt film and in glass substrate. The corresponding theoretical predictions match well with the experimental data in the whole delay time range.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- General Energy
- Physical and Theoretical Chemistry
- Surfaces, Coatings and Films