Challenges of Optical MEMS Packaging

Renshi Sawada

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	338-341
Number of pages	4
Journal	Journal of Japan Institute of Electronics Packaging
Volume	9
Issue number	5
DOIs	https://doi.org/10.5104/jiep.9.338
Publication status	Published - 2006

All Science Journal Classification (ASJC) codes

@article{5737eef12ace4eea833f40306f3d0147,

title = "Challenges of Optical MEMS Packaging",

author = "Renshi Sawada",

year = "2006",

doi = "10.5104/jiep.9.338",

language = "English",

volume = "9",

pages = "338--341",

journal = "Journal of Japan Institute of Electronics Packaging",

issn = "1343-9677",

publisher = "The Japan Institute of Electronics Packaging",

number = "5",

}

TY - JOUR

T1 - Challenges of Optical MEMS Packaging

AU - Sawada, Renshi

PY - 2006

Y1 - 2006

UR - http://www.scopus.com/inward/record.url?scp=85024444470&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85024444470&partnerID=8YFLogxK

U2 - 10.5104/jiep.9.338

DO - 10.5104/jiep.9.338

M3 - Article

AN - SCOPUS:85024444470

SN - 1343-9677

VL - 9

SP - 338

EP - 341

JO - Journal of Japan Institute of Electronics Packaging

JF - Journal of Japan Institute of Electronics Packaging

IS - 5

ER -