Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics

Chang Liu; Tadaaki Hoshi; Jiayi Shen; Atsushi Shinoda; Hisashi Kino; Tetsu Tanaka; Takafumi Fukushima

doi:10.35848/1347-4065/ad375f

Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics

Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

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1 Citation (Scopus)

Abstract

This study focuses on enhancing the bendability of flexible interconnects with out-of-plane corrugation for flexible hybrid electronics. We propose two typical configurations of 3D corrugated interconnects: serpentine and trapezoidal. Three methods are introduced to fabricate these corrugated interconnects. The advantages and drawbacks of each fabrication strategy are discussed, and the impact of the 3D corrugation geometry and material on bendability is elucidated. In addition, the material properties of two types of negative photosensitive materials, SU-8 and F-PD (flexible-photoimageable dielectric), are compared. Results show that the resistance increase of 3D corrugated interconnects after a 5 mm radius bending test is drastically lower (by approximately 1900%-2000%) than that of conventional 2D planar interconnects.

Original language	English
Article number	04SP74
Journal	Japanese journal of applied physics
Volume	63
Issue number	4
DOIs	https://doi.org/10.35848/1347-4065/ad375f
Publication status	Published - Apr 1 2024
Externally published	Yes

All Science Journal Classification (ASJC) codes

General Engineering
General Physics and Astronomy

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10.35848/1347-4065/ad375f

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abstract = "This study focuses on enhancing the bendability of flexible interconnects with out-of-plane corrugation for flexible hybrid electronics. We propose two typical configurations of 3D corrugated interconnects: serpentine and trapezoidal. Three methods are introduced to fabricate these corrugated interconnects. The advantages and drawbacks of each fabrication strategy are discussed, and the impact of the 3D corrugation geometry and material on bendability is elucidated. In addition, the material properties of two types of negative photosensitive materials, SU-8 and F-PD (flexible-photoimageable dielectric), are compared. Results show that the resistance increase of 3D corrugated interconnects after a 5 mm radius bending test is drastically lower (by approximately 1900%-2000%) than that of conventional 2D planar interconnects.",

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AU - Liu, Chang

AU - Hoshi, Tadaaki

AU - Shen, Jiayi

AU - Shinoda, Atsushi

AU - Kino, Hisashi

AU - Tanaka, Tetsu

AU - Fukushima, Takafumi

PY - 2024/4/1

Y1 - 2024/4/1

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AB - This study focuses on enhancing the bendability of flexible interconnects with out-of-plane corrugation for flexible hybrid electronics. We propose two typical configurations of 3D corrugated interconnects: serpentine and trapezoidal. Three methods are introduced to fabricate these corrugated interconnects. The advantages and drawbacks of each fabrication strategy are discussed, and the impact of the 3D corrugation geometry and material on bendability is elucidated. In addition, the material properties of two types of negative photosensitive materials, SU-8 and F-PD (flexible-photoimageable dielectric), are compared. Results show that the resistance increase of 3D corrugated interconnects after a 5 mm radius bending test is drastically lower (by approximately 1900%-2000%) than that of conventional 2D planar interconnects.

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Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics

Abstract

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