Abstract
A method and instrument for thickness measurement of a single Si crystal island in a compounded substrate consisting of a single Si crystal surrounded by SiO//2 dielectric film and polysilicon layer, the so-called dielectric insulation wafer, are described. The measuring instrument to which the Lichtschnitt method is applied, using an infrared slit beam, provided satisfactory accuracy within plus or minus 1. 5 mu m for the island thickness range from 10 to 400 mu m.
Original language | English |
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Pages (from-to) | 293-298 |
Number of pages | 6 |
Journal | Bulletin of the Japan Society of Precision Engineering |
Volume | 18 |
Issue number | 4 |
Publication status | Published - Dec 1 1984 |
All Science Journal Classification (ASJC) codes
- Engineering(all)