Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging

Atsushi Shinoda; Yuki Susumago; Chang Liu; Jiayi Shen; Tadaaki Hoshi; Hisashi Kino; Tetsu Tanaka; Takafumi Fukushima

doi:10.1109/ECTC51909.2023.00105

Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging

Atsushi Shinoda, Yuki Susumago, Chang Liu, Jiayi Shen, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

A new formation technology of long through-hole vias we call TXV (Through-X Via, where X is polydimethylsiloxane, epoxy, or hydrogel etc.) is demonstrated without electro-less or electroplating processes. In this study, tiny copper pillars with a diameter/height of 300/300 µm are assembled by a pick-and-place method and molded with a soft epoxy as a flexible substrate based on die-first fan-out wafer-level packaging (FOWLP). Double-sided metallization is performed on the epoxy to interconnect the copper pillars. Adhesion and oxidation issues are solved with an adhesion promotor and a cleaning technique to give desired double-sided wirings connected with the copper pillars. The resulting daisy chain using the copper pillars shows relatively low resistance and good mechanical stability against repeated bending.

Original language	English
Title of host publication	Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	596-600
Number of pages	5
ISBN (Electronic)	9798350334982
DOIs	https://doi.org/10.1109/ECTC51909.2023.00105
Publication status	Published - 2023
Externally published	Yes
Event	73rd IEEE Electronic Components and Technology Conference, ECTC 2023 - Orlando, United States Duration: May 30 2023 → Jun 2 2023

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	2023-May
ISSN (Print)	0569-5503

Conference

Conference	73rd IEEE Electronic Components and Technology Conference, ECTC 2023
Country/Territory	United States
City	Orlando
Period	5/30/23 → 6/2/23

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC51909.2023.00105

Cite this

Shinoda, A., Susumago, Y., Liu, C., Shen, J., Hoshi, T., Kino, H., Tanaka, T., & Fukushima, T. (2023). Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging. In Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023 (pp. 596-600). (Proceedings - Electronic Components and Technology Conference; Vol. 2023-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC51909.2023.00105

Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging. / Shinoda, Atsushi; Susumago, Yuki; Liu, Chang et al.
Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Institute of Electrical and Electronics Engineers Inc., 2023. p. 596-600 (Proceedings - Electronic Components and Technology Conference; Vol. 2023-May).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Shinoda, A, Susumago, Y, Liu, C, Shen, J, Hoshi, T, Kino, H, Tanaka, T & Fukushima, T 2023, Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging. in Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Proceedings - Electronic Components and Technology Conference, vol. 2023-May, Institute of Electrical and Electronics Engineers Inc., pp. 596-600, 73rd IEEE Electronic Components and Technology Conference, ECTC 2023, Orlando, United States, 5/30/23. https://doi.org/10.1109/ECTC51909.2023.00105

Shinoda A, Susumago Y, Liu C, Shen J, Hoshi T, Kino H et al. Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging. In Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Institute of Electrical and Electronics Engineers Inc. 2023. p. 596-600. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC51909.2023.00105

Shinoda, Atsushi ; Susumago, Yuki ; Liu, Chang et al. / Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging. Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Institute of Electrical and Electronics Engineers Inc., 2023. pp. 596-600 (Proceedings - Electronic Components and Technology Conference).

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abstract = "A new formation technology of long through-hole vias we call TXV (Through-X Via, where X is polydimethylsiloxane, epoxy, or hydrogel etc.) is demonstrated without electro-less or electroplating processes. In this study, tiny copper pillars with a diameter/height of 300/300 µm are assembled by a pick-and-place method and molded with a soft epoxy as a flexible substrate based on die-first fan-out wafer-level packaging (FOWLP). Double-sided metallization is performed on the epoxy to interconnect the copper pillars. Adhesion and oxidation issues are solved with an adhesion promotor and a cleaning technique to give desired double-sided wirings connected with the copper pillars. The resulting daisy chain using the copper pillars shows relatively low resistance and good mechanical stability against repeated bending.",

author = "Atsushi Shinoda and Yuki Susumago and Chang Liu and Jiayi Shen and Tadaaki Hoshi and Hisashi Kino and Tetsu Tanaka and Takafumi Fukushima",

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AU - Kino, Hisashi

AU - Tanaka, Tetsu

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Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging

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All Science Journal Classification (ASJC) codes

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