@inproceedings{a6bb66488ae14443bf4727dabf017cc0,
title = "Application of dielectric isolation technology based on soot bonding",
abstract = "A soot bonding method has been developed that solves the economic and limited-diameter problems associated with the conventional dielectrically isolated substrate. In this method, the Si-B-O soot particles used as adhesive agents are generated by essentially the same flame-hydrolysis technology used for fabricating optical waveguides. This soot bonding method is effective even for joining a surface with deep V-grooves or trenches, as well as for rough poly-Si-deposited surfaces. The ability to bond substrates with any joining surface conditions is expected to lead to wide application of this process and to a reduction of the steps, resulting in cost reduction.",
author = "R. Sawada and H. Nakada",
year = "1991",
language = "English",
isbn = "0780300092",
series = "Proc 3 Int Symp Power Semicond Devices ICs ISPSD 91",
publisher = "Publ by IEEE",
pages = "203--208",
editor = "Shibib, {Ayman M.} and Baliga, {Jayant B.}",
booktitle = "Proc 3 Int Symp Power Semicond Devices ICs ISPSD 91",
note = "Proceedings of the 3rd International Symposium on Power Semiconductor Devices and ICs - ISPSD '91 ; Conference date: 22-04-1991 Through 24-04-1991",
}