TY - JOUR
T1 - Analysis of shielding layers in HTS cable taking account of spiral structure
AU - Nakamura, Taketsune
AU - Kanzaki, Haruyuki
AU - Higashikawa, Kohei
AU - Hoshino, Tsutomu
AU - Muta, Itsuya
N1 - Funding Information:
Manuscript received October 4, 2004. This work was supported in part by 21st Century COE Program (no. 14213201) from The Ministry of Education, Culture, Sports, Science and Technology, Japan.
PY - 2005/6
Y1 - 2005/6
N2 - Analysis code for shielding layers of HTS cable, which was taken account of spiral structure of Bi-2223/Ag tape conductors, was developed based on finite element method. The 66 kV class HTS cable, which was fabricated and successfully tested in cooperation of Tokyo Electric Power Co. (TEPCO) and Sumitomo Electric Industries, Ltd. (SEI), was subjected in this study. Electric field vs. current density property was expressed based on percolation depinning model (Yamafuji-Kiss model). Multifilamentary structure of the tapes and spiral structure of the conductors were directly modeled in order to analyze precisely. Systematic analysis results were presented and discussed.
AB - Analysis code for shielding layers of HTS cable, which was taken account of spiral structure of Bi-2223/Ag tape conductors, was developed based on finite element method. The 66 kV class HTS cable, which was fabricated and successfully tested in cooperation of Tokyo Electric Power Co. (TEPCO) and Sumitomo Electric Industries, Ltd. (SEI), was subjected in this study. Electric field vs. current density property was expressed based on percolation depinning model (Yamafuji-Kiss model). Multifilamentary structure of the tapes and spiral structure of the conductors were directly modeled in order to analyze precisely. Systematic analysis results were presented and discussed.
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U2 - 10.1109/TASC.2005.849272
DO - 10.1109/TASC.2005.849272
M3 - Article
AN - SCOPUS:22144471530
SN - 1051-8223
VL - 15
SP - 1747
EP - 1750
JO - IEEE Transactions on Applied Superconductivity
JF - IEEE Transactions on Applied Superconductivity
IS - 2 PART II
ER -