TY - JOUR
T1 - Adhesion enhancement of Poly(etheretherketone) via surface-initiated photopolymerization of glycidyl methacrylate
AU - Zhang, Yucheng
AU - Hasegawa, Koichi
AU - Kamo, Sota
AU - Takagi, Kiyoka
AU - Takahara, Atsushi
N1 - Funding Information:
This work is based on results obtained from a project commissioned by the New Energy and Industrial Technology Development Organization (NEDO).
Publisher Copyright:
© 2020 Elsevier Ltd
PY - 2020/11/17
Y1 - 2020/11/17
N2 - Poly(etheretherketone) (PEEK) is a high-performance engineering thermoplastic with high heat deflection temperature. Owing to its low surface free energy, the untreated PEEK adherend may exhibit low bond shear strength with epoxy adhesives. This work presents a method to improve the adhesion performance of PEEK with epoxy adhesives through poly(glycidyl methacrylate) (PGMA) grafting. The PGMA-grafted PEEK (PEEK-g-PGMA) was prepared via surface-initiated photopolymerization under 2 and 8 mW/cm2, respectively. The influence of the irradiation duration and the removal of the polymerization inhibitor from the monomer on PGMA grafting are discussed herein. The results showed that (1) the PEEK-g-PGMA is obtained from the photopolymerization under 2 and 8 mW/cm2 of UV irradiation; (2) the long durations of the UV exposure promoted the formation of brushes; and (3) the polymerization inhibitor only slightly inhibited the polymerization, but effectively prevented the auto-polymerization of monomer solution during the UV irradiation. The enhanced performance of the epoxy adhesives was demonstrated by the single-lap shear tests using PEEK-g-PGMA joints. Under optimized concoctions, the lap shear strength of PEEK-g-PGMA was significantly enhanced to 15.1 MPa which is seven times higher than that of unmodified PEEK (2.5 MPa).
AB - Poly(etheretherketone) (PEEK) is a high-performance engineering thermoplastic with high heat deflection temperature. Owing to its low surface free energy, the untreated PEEK adherend may exhibit low bond shear strength with epoxy adhesives. This work presents a method to improve the adhesion performance of PEEK with epoxy adhesives through poly(glycidyl methacrylate) (PGMA) grafting. The PGMA-grafted PEEK (PEEK-g-PGMA) was prepared via surface-initiated photopolymerization under 2 and 8 mW/cm2, respectively. The influence of the irradiation duration and the removal of the polymerization inhibitor from the monomer on PGMA grafting are discussed herein. The results showed that (1) the PEEK-g-PGMA is obtained from the photopolymerization under 2 and 8 mW/cm2 of UV irradiation; (2) the long durations of the UV exposure promoted the formation of brushes; and (3) the polymerization inhibitor only slightly inhibited the polymerization, but effectively prevented the auto-polymerization of monomer solution during the UV irradiation. The enhanced performance of the epoxy adhesives was demonstrated by the single-lap shear tests using PEEK-g-PGMA joints. Under optimized concoctions, the lap shear strength of PEEK-g-PGMA was significantly enhanced to 15.1 MPa which is seven times higher than that of unmodified PEEK (2.5 MPa).
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U2 - 10.1016/j.polymer.2020.122971
DO - 10.1016/j.polymer.2020.122971
M3 - Article
AN - SCOPUS:85090338638
SN - 0032-3861
VL - 209
JO - polymer
JF - polymer
M1 - 122971
ER -