TY - GEN
T1 - A tri-level 50MS/s 10-bit capacitive-DAC for Bluetooth applications
AU - Kanemoto, Daisuke
AU - Oshiro, Keigo
AU - Yoshida, Keiji
AU - Kanaya, Haruichi
PY - 2015/3/11
Y1 - 2015/3/11
N2 - This document summarizes, for the university design contest, a chip design of a low power dissipation and small die area 10-bit capacitive digital-to-analog converter (DAC) in a 0.18 μm CMOS process. Power dissipation of this chip is 350 μW including the output buffers. The die area is 0.081mm2.
AB - This document summarizes, for the university design contest, a chip design of a low power dissipation and small die area 10-bit capacitive digital-to-analog converter (DAC) in a 0.18 μm CMOS process. Power dissipation of this chip is 350 μW including the output buffers. The die area is 0.081mm2.
UR - http://www.scopus.com/inward/record.url?scp=84926452899&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84926452899&partnerID=8YFLogxK
U2 - 10.1109/ASPDAC.2015.7058973
DO - 10.1109/ASPDAC.2015.7058973
M3 - Conference contribution
AN - SCOPUS:84926452899
T3 - 20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015
SP - 34
EP - 35
BT - 20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2015 20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015
Y2 - 19 January 2015 through 22 January 2015
ER -