This paper focuses on the surface finishing of a micropart made of single-crystal silicon. First, polishing experiments for a rough silicon surface are performed using an optically controlled silica particle with a diameter of 5 μm as a microparticle tool. The root mean square roughness (Rq) of the finished surface in the processed area is 23.2 nm, which is less than the initial surface roughness of 27.1 nm Rq. The fine polishing of a Si wafer specimen with an initial surface roughness of 4.3 nm Rq is then conducted using a silica particle with a diameter of 3 μm. Subsequently, a reference position detection method is introduced. The experimental results reveal that the surface roughness with a spatial wavelength ranging from 1 μm to 10 nm, over an area of several square micrometers, can be improved to the order of nanometers.
All Science Journal Classification (ASJC) codes
- Mechanical Engineering
- Industrial and Manufacturing Engineering