TY - GEN
T1 - A new deformation region and how low do you go? - "intrinsic deformation limit"
AU - Shen, Junjie
AU - Ikeda, Kenichi
AU - Hata, Satoshi
AU - Nakashima, Hideharu
N1 - Copyright:
Copyright 2020 Elsevier B.V., All rights reserved.
PY - 2013
Y1 - 2013
N2 - The creep deformation in pure aluminum was investigated using helicoid spring samples at room temperature, 298 K, and σ < 1.19 MPa. It was found that the stress exponent is n = 0, which means the creep behavior in this region is independent on applied stress but some physical properties of materials. The creep behavior was suggested to be controlled by surface diffusion based on the strongly effect of surface area on creep behavior only in this creep region (n = 0). The threshold creep rate, th ∑th, called "intrinsic deformation limit", decided by surface diffusion was suggested. This discovery provided a new perspective to understand the extremely slow deformation in the nature.
AB - The creep deformation in pure aluminum was investigated using helicoid spring samples at room temperature, 298 K, and σ < 1.19 MPa. It was found that the stress exponent is n = 0, which means the creep behavior in this region is independent on applied stress but some physical properties of materials. The creep behavior was suggested to be controlled by surface diffusion based on the strongly effect of surface area on creep behavior only in this creep region (n = 0). The threshold creep rate, th ∑th, called "intrinsic deformation limit", decided by surface diffusion was suggested. This discovery provided a new perspective to understand the extremely slow deformation in the nature.
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U2 - 10.4028/www.scientific.net/MSF.747-748.559
DO - 10.4028/www.scientific.net/MSF.747-748.559
M3 - Conference contribution
AN - SCOPUS:84875168143
SN - 9783037856086
T3 - Materials Science Forum
SP - 559
EP - 563
BT - High Performance Structure Materials
A2 - Han, Yafang
A2 - Lin, Junpin
A2 - Xiao, Chengbo
A2 - Zeng, Xiaoqin
PB - Trans Tech Publications Ltd
T2 - Chinese Materials Congress 2012, CMC 2012
Y2 - 13 July 2012 through 18 July 2012
ER -