A Monte Carlo-shear lag simulation of tensile fracture behaviour of Bi2223 filament

S. Ochiai, T. Ishida, D. Doko, K. Morishita, H. Okuda, S. S. Oh, D. W. Ha, M. Hojo, M. Tanaka, M. Sugano, K. Osamura

Research output: Contribution to journalArticlepeer-review

21 Citations (Scopus)


The damage evolution in Bi2223 filaments and its influence on critical current was described by a Monte Carlo-shear lag simulation method. The experimentally observed zigzag crack propagation across aligned Bi2223 grains under tensile strain was effectively modelled by including transverse and longitudinal failure modes for individual grains. From the simulated stress-strain curve, the survival parameter (slope of the stress-strain curve normalized with respect to the original Young's modulus) was estimated with increasing applied strain. With this parameter combined with the strain sensitivity of the critical current, the measured change of critical current of the composite tape with applied strain could be described well.

Original languageEnglish
Pages (from-to)S232-S240
JournalSuperconductor Science and Technology
Issue number12
Publication statusPublished - Dec 1 2005
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Ceramics and Composites
  • Metals and Alloys
  • Materials Chemistry
  • Electrical and Electronic Engineering


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