TY - JOUR
T1 - 60 GHz millimeter-wave CMOS integrated on-chip open loop resonator bandpass filters on patterned ground shields
AU - Pokharel, Ramesh K.
AU - Liu, Xin
AU - Mat, Dayang A.A.
AU - Dong, Ruibing
AU - Kanaya, Haruichi
AU - Yoshida, Keiji
PY - 2013/2
Y1 - 2013/2
N2 - This paper presents the design of a second-order and a fourth-order bandpass filter (BPF) for 60 GHz millimeter-wave applications in 0.18 μm CMOS technology. The proposed on-chip BPFs employ the folded open loop structure designed on pattern ground shields. The adoption of a folded structure and utilization of multiple transmission zeros in the stopband permit the compact size and high selectivity for the BPF. Moreover, the pattern ground shields obviously slow down the guided waves which enable further reduction in the physical length of the resonator, and this, in turn, results in improvement of the insertion losses. A very good agreement between the electromagnetic (EM) simulations and measurement results has been achieved. As a result, the second-order BPF has the center frequency of 57.5 GHz, insertion loss of 2.77 dB, bandwidth of 14 GHz, return loss less than 27.5 dB and chip size of 650 μm × 810 μm (including bonding pads) while the fourth-order BPF has the center frequency of 57 GHz, insertion loss of 3.06 dB, bandwidth of 12 GHz, return loss less than 30 dB with chip size of 905 μm × 810 μm (including bonding pads).
AB - This paper presents the design of a second-order and a fourth-order bandpass filter (BPF) for 60 GHz millimeter-wave applications in 0.18 μm CMOS technology. The proposed on-chip BPFs employ the folded open loop structure designed on pattern ground shields. The adoption of a folded structure and utilization of multiple transmission zeros in the stopband permit the compact size and high selectivity for the BPF. Moreover, the pattern ground shields obviously slow down the guided waves which enable further reduction in the physical length of the resonator, and this, in turn, results in improvement of the insertion losses. A very good agreement between the electromagnetic (EM) simulations and measurement results has been achieved. As a result, the second-order BPF has the center frequency of 57.5 GHz, insertion loss of 2.77 dB, bandwidth of 14 GHz, return loss less than 27.5 dB and chip size of 650 μm × 810 μm (including bonding pads) while the fourth-order BPF has the center frequency of 57 GHz, insertion loss of 3.06 dB, bandwidth of 12 GHz, return loss less than 30 dB with chip size of 905 μm × 810 μm (including bonding pads).
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U2 - 10.1587/transele.E96.C.270
DO - 10.1587/transele.E96.C.270
M3 - Article
AN - SCOPUS:84873631461
SN - 0916-8524
VL - E96-C
SP - 270
EP - 276
JO - IEICE Transactions on Electronics
JF - IEICE Transactions on Electronics
IS - 2
ER -