TY - GEN
T1 - 3D-microfluidic device to remove zona pellucida fabricated by mask-less exposure technology
AU - Yamanishi, Yoko
AU - Nakano, Takuma
AU - Sawada, Yu
AU - Itoga, Kazuyoshi
AU - Okano, Teruo
AU - Arai, Fumihito
PY - 2010
Y1 - 2010
N2 - This paper presents a novel method of three-dimensional fabrication using Mask-less exposure equipment and a three dimensional microfluidic application for the cell manipulation. The grayscale data can directly control the height of the photoresist to be exposed without using any mask. Three-dimensional microchannel was successfully fabricated simply by using the low cost exposure system with the height range of 0-200 μm. We have succeeded in removing the zona pellucida of oocyte passing through the 3D-microchannel whose cross section is gradually restricted along the path to provide mechanical stimuli on the surface of the oocyte in every direction. This microfluidic chip contributes to the effective high throughput of the peeled oocyte without damaging them.
AB - This paper presents a novel method of three-dimensional fabrication using Mask-less exposure equipment and a three dimensional microfluidic application for the cell manipulation. The grayscale data can directly control the height of the photoresist to be exposed without using any mask. Three-dimensional microchannel was successfully fabricated simply by using the low cost exposure system with the height range of 0-200 μm. We have succeeded in removing the zona pellucida of oocyte passing through the 3D-microchannel whose cross section is gradually restricted along the path to provide mechanical stimuli on the surface of the oocyte in every direction. This microfluidic chip contributes to the effective high throughput of the peeled oocyte without damaging them.
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U2 - 10.1109/SII.2010.5708335
DO - 10.1109/SII.2010.5708335
M3 - Conference contribution
AN - SCOPUS:79952803674
SN - 9781424493159
T3 - 2010 IEEE/SICE International Symposium on System Integration: SI International 2010 - The 3rd Symposium on System Integration, SII 2010, Proceedings
SP - 260
EP - 265
BT - 2010 IEEE/SICE International Symposium on System Integration
T2 - 3rd International Symposium on System Integration, SII 2010
Y2 - 21 December 2010 through 22 December 2010
ER -