TY - GEN
T1 - 3D image analysis for evaluating internal deformation / fracture characteristics of materials
AU - Nakazawa, Mitsuru
AU - Aoki, Yoshimitsu
AU - Kawai, Yuji
AU - Kobayashi, Masakazu
AU - Toda, Hiroyuki
PY - 2006/12/1
Y1 - 2006/12/1
N2 - In order to understand deformation / fracture characteristics, many measurement methods have been proposed and developed. Almost all methods, however, have been limited on the surface indirectly due to insufficient resolution. Recently, third-generation synchrotron radiation facilities have enabled observations with high resolution. Therefore, the 3D mapping of structural features like air bubbles (pores) have been attempted to understand local deformation / fracture characteristics in some materials using the X-ray computed tomography (CT). However, there are some issues and one of them is long processing time. In this paper, we propose a system which can measure a 3D, local, high-accuracy deformation / fracture characteristic by obtaining the strain distribution. Experiments have proved its effectiveness.
AB - In order to understand deformation / fracture characteristics, many measurement methods have been proposed and developed. Almost all methods, however, have been limited on the surface indirectly due to insufficient resolution. Recently, third-generation synchrotron radiation facilities have enabled observations with high resolution. Therefore, the 3D mapping of structural features like air bubbles (pores) have been attempted to understand local deformation / fracture characteristics in some materials using the X-ray computed tomography (CT). However, there are some issues and one of them is long processing time. In this paper, we propose a system which can measure a 3D, local, high-accuracy deformation / fracture characteristic by obtaining the strain distribution. Experiments have proved its effectiveness.
UR - http://www.scopus.com/inward/record.url?scp=50249136125&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=50249136125&partnerID=8YFLogxK
U2 - 10.1109/IECON.2006.347950
DO - 10.1109/IECON.2006.347950
M3 - Conference contribution
AN - SCOPUS:50249136125
SN - 1424401364
SN - 9781424401369
T3 - IECON Proceedings (Industrial Electronics Conference)
SP - 3525
EP - 3530
BT - IECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics
T2 - IECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics
Y2 - 6 November 2006 through 10 November 2006
ER -