100 GHz Thin-Film LNOI/Si Optical Modulator Fabricated by Room Temperature Wafer Bonding

Seigo Murakami, Yoshiki Katoda, Yuya Yamaguchi, Takahide Sakamoto, Ryo Takigawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper demonstrated 100 GHz thin-film LNOI/Si optical modulator fabricated by room temperature wafer bonding with activated Si atomic layer.

Original languageEnglish
Title of host publication2024 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798331519919
DOIs
Publication statusPublished - 2024
Event8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024 - Nara, Japan
Duration: Oct 30 2024Nov 1 2024

Publication series

Name2024 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024

Conference

Conference8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024
Country/TerritoryJapan
CityNara
Period10/30/2411/1/24

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

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