Fingerprint
Dive into the research topics where Ryo Takigawa is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
-
Atomic-level contact formation between LiNbO3 and Si wafers via surface-activated bonding at room temperature
Murakami, S. & Takigawa, R., Feb 1 2026, In: Applied Surface Science. 717, 164850.Research output: Contribution to journal › Article › peer-review
-
Crystallographic structure of aluminum oxide bonding interfaces prepared via room‐temperature surface-activated bonding
Utsumi, J. & Takigawa, R., Jun 15 2025, In: Applied Surface Science. 694, 162825.Research output: Contribution to journal › Article › peer-review
-
Direct Cu films bonding via surface-activated bonding method at room temperature
Utsumi, J., Takakura, R. & Takigawa, R., Dec 2025, In: Materialia. 44, 102598.Research output: Contribution to journal › Article › peer-review
-
Freeze-Dried PVA Hydrogels with Superior Mechanical Properties: A Rapid Alternative to Conventional Methods
Sasaki, S., Miyauchi, S. & Takigawa, R., Dec 9 2025, In: Langmuir : the ACS journal of surfaces and colloids. 41, 48, p. 32569-32575 7 p.Research output: Contribution to journal › Article › peer-review
-
Investigation of Si/Si bond interface fabricated using room temperature direct bonding
Murakami, S. & Takigawa, R., Jun 1 2025, In: Surfaces and Interfaces. 66, 106124.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus)