Projects per year
Fingerprint
Collaborations and top research areas from the last five years
Profiles
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Misleading Algorithms: Interdisciplinary Perspectives on the Implications for Law
Van Uytsel, S. (PI) & Vargas, D. V. (PI)
Project: Research project
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Insulating, flexible, highly thermal conductive heat conduction sheets with diamond fillers
Inaba, M. (PI)
4/1/20 → 3/31/22
Project: Research project
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Temporal continuity and phonological discontinuity in linguistic communication: Collaboration between perceptual psychology, linguistics, and speech science
Nakajima, Y. (PI), Ueda, K. (CoI), Shiraishi, K. (CoI), Kaburagi, T. (CoI), Ito, H. (CoI), Sasaki, T. (CoI), Ohgushi, K. (CoI), Mori, S. (CoI) & Shimada, Y. (CoI)
4/1/07 → 3/31/12
Project: Research project
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An accurate analytical modeling method for microwave-based breast tumor detection and phantom manufacturing
Youssef, K., Abd El-Malek, A. H., Kanaya, H. & Abo-Zahhad, M., Jan 2026, In: Biomedical Engineering Letters. 16, 1, p. 41-54 14 p.Research output: Contribution to journal › Article › peer-review
Open Access -
Analysis of gain–efficiency relationship in a wideband rectenna for RF-powered IoT devices
Afify, Y. M., Allam, A., Kanaya, H. & Abdelrahman, A. B., Feb 2026, In: AEU - International Journal of Electronics and Communications. 205, 156158.Research output: Contribution to journal › Article › peer-review
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Atomic-level contact formation between LiNbO3 and Si wafers via surface-activated bonding at room temperature
Murakami, S. & Takigawa, R., Feb 1 2026, In: Applied Surface Science. 717, 164850.Research output: Contribution to journal › Article › peer-review
Activities
- 1 Invited talk
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ソニーセミコンダクタソリューションズグループのイメージセンサー技術
Watanabe, K. (Speaker)
Jun 2022Activity: Talk or presentation types › Invited talk
Press/Media
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New Ink Jet Approach Offers Simple Way to Print Microdisk Lasers for Biosensing
2/3/21
1 item of Media coverage
Press/Media: Press / Media
Prizes
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ACM Ubicomp/ISWC2016 Best Demo Award
Nakamura, Y. (Recipient), Arakawa, Y. (Recipient) & Yasumoto, K. (Recipient), Oct 2016
Prize
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ACM Ubicomp/ISWC2021 Best Poster Honorable Mention Award
Nakamura, Y. (Recipient) & Matsuda, Y. (Recipient), Sept 2021
Prize